Advanced Packaging Market $89B by 2030 Zero neutral US OSAT facilities today AI hardware bottleneck is packaging HBM demand 3–5× by 2027 No OSAT facility in Australia — not one CHIPS Act — $39B available now Advanced Packaging Market $89B by 2030 Zero neutral US OSAT facilities today AI hardware bottleneck is packaging HBM demand 3–5× by 2027 No OSAT plant in Australia — not one CHIPS Act — $39B available now
Advanced Semiconductor Packaging & Test · AI Compute

Australia's First OSAT. America's First Neutral One.

TSMC, Amkor, and ASE control advanced packaging globally. None offer the transparency, speed, and sovereign security that hyperscalers and AI chip companies actually need.

NextZen AI is building the facility that does — from the ground up, for the AI compute era.

Talk to Our Founder See the opportunity
$89B
Advanced packaging by 2030
0
Neutral US OSAT facilities today
5×
HBM demand growth by 2027
$39B
CHIPS Act capital available
The Opportunity

Two gaps.
One facility
to fill them.

01
The United States Gap
Every hyperscaler — AWS, Google, Microsoft, NVIDIA — runs advanced packaging through TSMC, Amkor, or ASE. All are foreign-owned. None offer auditable, US-sovereign, transparent capacity with live dashboards and 72-hour failure analysis turnaround.

The US has no neutral OSAT facility purpose-built for the AI era. That gap is funded by CHIPS Act, demanded by hyperscalers, and owned by nobody. Yet.
02
The Australia Gap
Australia is an AUKUS partner, home to AWS, Microsoft, and Google Cloud data centres, and a Five Eyes intelligence nation with growing AI infrastructure investment.

There is not a single OSAT plant in Australia. Not one. The National Reconstruction Fund has $15B AUD to deploy. The market is completely open. The first mover owns it permanently.

Not another
OSAT.
A new kind
of facility.

72-Hour Failure Analysis
GPU and HBM module FA in 72 hours guaranteed. Live customer dashboard. Real-time defect pareto. Full chain of custody. No black box. This is what hyperscalers cannot get from any incumbent today.
Core Differentiator
2.5D / 3D Advanced Packaging
Flip-chip BGA, HBM stack integration, chiplet assembly, and silicon interposer builds. Time-boxed NPI pilot windows. Copy-exact discipline from day one. Built for the AI compute module era.
Phase 1 — Australia
🛡
Secure Sovereign Capacity
ITAR-compliant secure bays. Auditable quality data. US-sovereign supply chain for defence and intelligence community packaging needs. The trust layer that TSMC structurally cannot offer.
Defence + Gov
Live Intelligence Dashboard
Every customer gets a real-time portal showing yield trends, WIP tracking, SPC control charts, and FA status. Packaging as a transparent service, not a black box. First in the industry.
Industry First
Copy-Exact Global Scale
Every process, every flow, every qualification — documented to copy-exact standards from Site One. US to Australia. Same yield. Same quality. Same customer experience. Scalable by design.
Multi-Country
AI-Native Operations
MES architecture built for real-time AI inference. Predictive yield modelling. Automated defect classification. The first OSAT built with zero-trust and chain-of-custody by design for an AI-first world.
NextGen Ops
Global Expansion

Two facilities.
One standard.
$1B+ destination.

Phase 1 — Active
Year 0 → 3 · Melbourne, Victoria, Australia
Australia — Build the First Facility
FA lab and NPI pilot attach line in a greenfield industrial facility. Target LOIs: AWS, NVIDIA, Microsoft, Supermicro. Zero OSAT competitors. NRF $15B co-investment pathway. AUKUS sovereign demand. Victorian Government support. Copy-exact process playbook documented for replication. First revenue from retainers and NRE deposits before capital raise closes.
$200M
Revenue Target
$39B
CHIPS Act Available
72hr
FA SLA Guarantee
Phase 2 — Pipeline
Year 2 → 5 · Folsom / Sacramento, CA + Phoenix, AZ
United States — Sovereign AI Packaging
The US has no neutral OSAT facility purpose-built for the AI era. CHIPS Act funding pipeline. SMUD power advantage in Sacramento corridor. AWS, NVIDIA, Microsoft, Supermicro as target anchor customers. Copy-exact process playbook replicated from AU Site One.
$200M
Revenue Target
$15B
NRF Available
0
OSAT Competitors in AU

The window
is open now.
Not in five years.

11%
Annual Market Growth Rate
Advanced packaging is growing at 11.73% CAGR — driven by heterogeneous integration that has become indispensable for AI processors exceeding thermal and interconnect limits of conventional packaging. The bottleneck is not chips. It is packaging.
$7B
Amkor's Arizona Validation
Amkor just broke ground on a $7B advanced packaging campus in Arizona and received $407M in CHIPS Act funding. This is the market validation signal every investor needed. The infrastructure supercycle is not coming — it is here.
0
Zero Neutral US Facilities Today
TSMC is Taiwanese. Amkor is Korean-managed. ASE is Taiwanese. No neutral, auditable, US-operated OSAT facility exists for hyperscalers who need sovereign assurance. NextZen AI owns that position by default.
20yr
AI Hardware Supercycle
GPU clusters, HBM stacks, and AI accelerators will require advanced packaging at scale for the next two decades. This is not a product cycle. It is infrastructure for the AI economy — the same way data centres were infrastructure for the internet.
The Founder

Built by someone
who has lived
both worlds.

SR
Shantanuu Roy
Founder & CEO
Founder & CEO · NextZen AI
20+ years · Enterprise & Government Advisory
ANZ Bank · NBN Australia · Federal Government
CISM · CISA Certified
US semiconductor corridor · Melbourne, Australia
"I spent 20 years building sovereign infrastructure for Australia's most critical institutions. The AI economy is being bottlenecked by packaging infrastructure that the hyperscalers don't trust and the world doesn't have enough of. NextZen AI is my answer to both problems simultaneously."
Shantanuu Roy is a founder and enterprise advisor with two decades of experience protecting critical enterprise infrastructure across finance, healthcare, and technology. His background in zero-trust architecture, chain-of-custody systems, and auditable security posture is the unique lens through which NextZen AI's OSAT facility is designed — not just as a manufacturing business, but as a trust infrastructure for the AI supply chain.

With deep exposure to the US semiconductor corridor and relationships across the Bay Area hyperscaler cluster, Shantanuu brings US market intelligence that most Melbourne-based founders spend years trying to build.

He is actively building the technical co-founder team and seeking anchor investors who understand that the packaging bottleneck is the defining infrastructure challenge of the AI decade.

The moats
are structural,
not incremental.

First OSAT in Australia
No OSAT facility exists in Australia. The first to build it owns the government co-investment, the defence contracts, and the hyperscaler LOIs permanently. This advantage cannot be bought — only built.
Non-Dilutive Capital Stack
CHIPS Act (US) and NRF AUD $15B (AU) provide government co-investment across both facilities. The majority of capex is fundable without giving up equity.
🛡
Security-Native Design
Built with zero-trust design from day one. ITAR compliance, secure bays, and chain-of-custody are designed into the facility from day one — not bolted on. The trust posture incumbents cannot replicate.
Copy-Exact Replication
Every process, every flow, every qualification — documented to copy-exact standards from Site One. Yield and quality are identical across US and AU. Same process. Same yield. Same customer experience at every facility.
Hyperscaler-Aligned Specs
72-hour FA SLA, live customer dashboards, and time-boxed NPI windows are designed around what AWS, NVIDIA, Microsoft, and Google actually need — and cannot get from incumbents today.
20-Year Supercycle Tailwind
AI hardware investment is not a product cycle. It is a two-decade infrastructure build. NextZen AI's revenue grows every time a new GPU cluster or AI accelerator is deployed anywhere in the world.

The facility
the AI economy
cannot exist without.

NextZen AI is raising its pre-seed round to fund site selection, anchor LOI execution, and the first technical co-founder and operations hires. The packaging bottleneck is today — not in two years. This is the moment to be in the room.

[email protected]  ·  +61 452 410 215 (AU) · +1 916 809 6704 (US) · Melbourne, Australia & United States